НовоСим

Full-cycle SIM card manufacturing

The SIM card manufacturing cycle covers product development, printing, card forming, personalization, packaging and quality control.

Full-cycle manufacturing in Russia

Manufacturing

A full SIM card production cycle, from product development and design printing to personalization, packaging, and delivery of finished products.

NovoSim's manufacturing facilities are currently located at the site of ООО «НОВОПАК», where product packaging is also performed. NovoSim and Novopak belong to the same group of companies.

  1. 01

    Development and data

    SIM product development and configuration, plus data generation and storage on our own servers.

  2. 02

    Design printing

    Printing the approved design on plastic and inspecting print quality.

  3. 03

    Card forming

    Lamination, plastic milling, and chip-module implantation.

  4. 04

    Form factor

    Die-cutting 2FF, 3FF, and 4FF formats for SIM or Half-SIM.

  5. 05

    Personalization

    Electronic and laser personalization of the product.

  6. 06

    Packaging

    Packaging production, SIM card packing, and batch assembly.

  7. 07

    Quality control

    Product and batch inspection against agreed acceptance criteria.

  8. 08

    Delivery

    Delivery of finished products to the regions.

Volumes and lead times

From test samples to commercial batches

Batch size and production lead time are determined after assessing the requirements of the specific project.

Quality control

Industry requirements

The inspection scope and acceptance criteria are defined for each product and project.

Processes and data

Security

Internal processes use access controls for information and materials.

Manufacturing-cycle scope

The stages are grouped by purpose to distinguish product preparation, card forming, and batch completion.

Product preparation

SIM product development, data generation and storage, and printing of the approved design take place before the finished card is formed.

Card forming

The production route covers lamination, milling, chip-module implantation, and die-cutting into 2FF, 3FF, or 4FF formats.

Batch completion

Electronic and laser personalization are followed by inspection, packaging production, packing, batch assembly, and delivery.